(DOWNLOAD) "Advanced Interconnects for ULSI Technology" by Mikhail Baklanov, Paul S. Ho & Ehrenfried Zschech ~ Book PDF Kindle ePub Free
eBook details
- Title: Advanced Interconnects for ULSI Technology
- Author : Mikhail Baklanov, Paul S. Ho & Ehrenfried Zschech
- Release Date : January 17, 2012
- Genre: Electrical Engineering,Books,Professional & Technical,Engineering,
- Pages : * pages
- Size : 38324 KB
Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:
Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects
Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.